Embedded World 2025 – The TOFU Family Goes Global
Embedded World 2025 was Oratek’s third participation at the show — and the most technically intensive one yet. The focus was clear: present the TOFU5 and TOFU5+ to engineers and decision-makers from around the world, and engage in the kind of deep, hands-on conversations that only happen at Embedded World.
A Platform Built for the Long Game
The TOFU family is built around a core idea: your carrier board should evolve with the compute module generations, without forcing you to redesign your environment.
When Raspberry Pi released the Compute Module 5, Oratek evolved the carrier board accordingly — introducing the TOFU5 and TOFU5+. But the connector layout, the interface positions, the HDMI, USB and peripheral connections all remain in the same place. Your existing enclosure, your existing cabling, your existing setup: it all stays compatible.
You get the performance of the new generation without the integration cost of starting over. That’s the promise of the TOFU family, and it resonated strongly on the floor at Embedded World 2025.
TOFU5+ – Meaningful New Capabilities
Beyond backward compatibility, the TOFU5+ introduces features that engineers immediately understood the value of. The dual M.2 connector was the headline — opening the door to NVMe storage, LTE modules, AI accelerators, and other expansion cards in a compact, production-ready form factor.
This is not a feature added for the spec sheet. It directly addresses use cases that come up repeatedly in industrial embedded deployments: local high-speed storage, connectivity independence, and on-board inference. The feedback from visitors confirmed it — this was one of the most discussed features at the booth.
Deep Technical Conversations
Embedded World attracts a technically demanding audience, and the 2025 edition was no exception. Discussions at the Oratek booth went deep — into thermal management, carrier board design choices, Compute Module compatibility, software stack considerations, and integration scenarios across industries.
The quality of those conversations — with engineers from across Europe, Asia, and the Americas — confirmed that the TOFU platform addresses real, recurring challenges in embedded product development.
A Recurring Rendez-Vous
Oratek first presented the original TOFU board at Embedded World 2023 — its first appearance at the show and the first public introduction of the platform. That edition established Oratek’s presence in the global embedded community. The 2025 edition marked a clear step forward: a mature platform, an expanded product family, and a broader international audience engaging with it.
Swiss Design. Swiss Made.
The booth carried the message plainly: swiss design | swiss made. For a product competing in a global embedded market, the origin and the design rigour it implies are part of the value proposition — not just a label.
To learn more about the TOFU family or request documentation, visit the TOFU product page or contact us directly.
